Materials Declaration Report: A6260KLJTR-T
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Part Number:
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A6260KLJTR-T
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Package Code:
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LJ
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Lead Count:
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8
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Plating:
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Sn
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Package Weight:
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0.07964 g
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MSL Rating:
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3
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Composition Details
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Bonding Wire
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| Substances |
weight |
% of material |
% of package |
| Gold |
Au |
0.00025000 g |
99.99992 % |
0.31391 % |
| Misc. |
|
0.00000000 g |
0.00008 % |
0.00000 % |
| Total: |
0.00025000 g |
|
|
Die
|
| Substances |
weight |
% of material |
% of package |
| Aluminum |
Al |
0.00002880 g |
1.00000 % |
0.03616 % |
| Silicon |
Si |
0.00285120 g |
99.00000 % |
3.58011 % |
| Total: |
0.00288000 g |
|
|
Die Attach Adhesive
|
| Substances |
weight |
% of material |
% of package |
| Silver |
Ag |
0.00131200 g |
80.00000 % |
1.64741 % |
| Polyimide |
Pl |
0.00032800 g |
20.00000 % |
0.41185 % |
| Total: |
0.00164000 g |
|
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Encapsulation
|
| Substances |
weight |
% of material |
% of package |
| Carbon black |
C |
0.00014808 g |
0.30000 % |
0.18594 % |
| Epoxy resin |
EP |
0.00370200 g |
7.50000 % |
4.64842 % |
| Phenolic Resin |
|
0.00246800 g |
5.00000 % |
3.09895 % |
| Silica, vitreous |
Si |
0.04304192 g |
87.20000 % |
54.04560 % |
| Total: |
0.04936000 g |
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Lead Finish
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| Substances |
weight |
% of material |
% of package |
| Misc. |
|
0.00000011 g |
0.01000 % |
0.00014 % |
| Tin |
Sn |
0.00108989 g |
99.99000 % |
1.36852 % |
| Total: |
0.00109000 g |
|
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Lead Frame
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| Substances |
weight |
% of material |
% of package |
| Silver |
Ag |
0.00036630 g |
1.50000 % |
0.45994 % |
| Copper |
Cu |
0.02341687 g |
95.89218 % |
29.40340 % |
| Iron |
Fe |
0.00057387 g |
2.35000 % |
0.72058 % |
| Lead |
Pb |
0.00000020 g |
0.00082 % |
0.00025 % |
| Phosphorus |
P |
0.00002002 g |
0.08200 % |
0.02514 % |
| Zinc (metal) |
Zn |
0.00004274 g |
0.17500 % |
0.05366 % |
| Total: |
0.02442000 g |
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For information on "Green" molding compounds, please contact your local sales representative.
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RoHS and other substances of concern
| Bonding Wire |
| Substances |
0.00025000 g |
ppm |
w/avg ppm |
| Cadmium |
Cd |
|
< 2 ppm |
< 0.006 ppm |
| Hexavalent Chromium |
Cr+6 |
|
< 2 ppm |
< 0.006 ppm |
| Lead |
Pb |
|
< 2 ppm |
< 0.006 ppm |
| Mercury |
Hg |
|
< 2 ppm |
< 0.006 ppm |
| Polybrominated Biphenyls |
PBB |
|
< 5 ppm |
< 0.016 ppm |
| Polybrominated Diphenyl Ethers |
PBDE |
|
< 5 ppm |
< 0.016 ppm |
| Die |
| Substances |
0.00288000 g |
ppm |
w/avg ppm |
| Cadmium |
Cd |
|
< 2 ppm |
< 0.072 ppm |
| Hexavalent Chromium |
Cr+6 |
|
< 2 ppm |
< 0.072 ppm |
| Lead |
Pb |
|
< 2 ppm |
< 0.072 ppm |
| Mercury |
Hg |
|
< 2 ppm |
< 0.072 ppm |
| Polybrominated Biphenyls |
PBB |
|
< 5 ppm |
< 0.181 ppm |
| Polybrominated Diphenyl Ethers |
PBDE |
|
< 5 ppm |
< 0.181 ppm |
| Die Attach Adhesive |
| Substances |
0.00164000 g |
ppm |
w/avg ppm |
| Bromine |
Br |
|
< 30 ppm |
< 0.618 ppm |
| Cadmium |
Cd |
|
< 2 ppm |
< 0.041 ppm |
| Chlorine |
Cl |
|
= 69 ppm |
= 1.421 ppm |
| Hexavalent Chromium |
Cr+6 |
|
< 2 ppm |
< 0.041 ppm |
| Lead |
Pb |
|
< 2 ppm |
< 0.041 ppm |
| Mercury |
Hg |
|
< 2 ppm |
< 0.041 ppm |
| Polybrominated Biphenyls |
PBB |
|
< 5 ppm |
< 0.103 ppm |
| Polybrominated Diphenyl Ethers |
PBDE |
|
< 5 ppm |
< 0.103 ppm |
| Encapsulation |
| Substances |
0.04936000 g |
ppm |
w/avg ppm |
| Cadmium |
Cd |
|
< 2 ppm |
< 1.240 ppm |
| Hexavalent Chromium |
Cr+6 |
|
< 2 ppm |
< 1.240 ppm |
| Lead |
Pb |
|
< 2 ppm |
< 1.240 ppm |
| Mercury |
Hg |
|
< 2 ppm |
< 1.240 ppm |
| Polybrominated Biphenyls |
PBB |
|
< 5 ppm |
< 3.099 ppm |
| Polybrominated Diphenyl Ethers |
PBDE |
|
< 5 ppm |
< 3.099 ppm |
| Lead Finish |
| Substances |
0.00109000 g |
ppm |
w/avg ppm |
| Cadmium |
Cd |
|
< 2 ppm |
< 0.027 ppm |
| Hexavalent Chromium |
Cr+6 |
|
< 2 ppm |
< 0.027 ppm |
| Lead |
Pb |
|
= 24 ppm |
= 0.328 ppm |
| Mercury |
Hg |
|
< 2 ppm |
< 0.027 ppm |
| Polybrominated Biphenyls |
PBB |
|
< 5 ppm |
< 0.068 ppm |
| Polybrominated Diphenyl Ethers |
PBDE |
|
< 5 ppm |
< 0.068 ppm |
| Lead Frame |
| Substances |
0.02442000 g |
ppm |
w/avg ppm |
| Cadmium |
Cd |
|
< 2 ppm |
< 0.613 ppm |
| Hexavalent Chromium |
Cr+6 |
|
< 2 ppm |
< 0.613 ppm |
| Lead |
Pb |
|
= 29 ppm |
= 8.892 ppm |
| Mercury |
Hg |
|
< 2 ppm |
< 0.613 ppm |
| Polybrominated Biphenyls |
PBB |
|
< 5 ppm |
< 1.533 ppm |
| Polybrominated Diphenyl Ethers |
PBDE |
|
< 5 ppm |
< 1.533 ppm |
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The less than (<) symbol is used to indicate that the test results are below
the amounts indicated, which are the minimum detection limits of the laboratory
performing the testing. The exception to this is for plating containing lead, where
the maximum amount of lead is listed.
RoHS maximum limits (ppm): 1000 for Pb, Hg, Cr6+, PBB, PBDE (exemption: lead if
solderballs are used.) 100 for Cd.
Reportable substances (if present): Antimony Trioxide, Brominated Flame Retardants,
Nickel.
Weighted average = for part as a whole.
The information included herein is believed to be accurate and reliable. However,
Allegro MicroSystems, Inc. assumes no responsibility for its use. The user is cautioned
to verify that the information being relied upon is current.
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As a supplier of components, we are not required to assess regulatory requirements (such as the
European RoHS Directive (2003/95/EC) - hereinafter referred to as RoHS) that apply to finished
product. Please note further that product may contain small amounts of lead. Therefore, we cannot
make representations, warranties or indemnities regarding the complete absence of lead in the finished product.
You will note that, if there is sufficient volume and the above referenced product is not below RoHS allowable
thresholds, we are prepared to discuss making a product listed by Allegro that is below RoHS allowable thresholds.
Allegro MicroSystems, Inc. is a cooperative environmental supplier who fully supports global environmental initiatives.
We value our customer relationships and are committed to provide the highest levels of quality standards.
Geoffrey H. DesRosiers
Quality Systems Specialist