Materials Declaration Report: ACS713ELCTR-30A-T
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Part Number:
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ACS713ELCTR-30A-T
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Package Code:
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LC
|
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Lead Count:
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8
|
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Bump Count:
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4
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Plating:
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Sn
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Package Weight:
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0.07264927 g
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MSL Rating:
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2
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Composition Details
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Die
|
| Substances |
weight |
% of material |
% of package |
| Aluminum |
Al |
0.00002699 g |
1.00000 % |
0.03715 % |
| Silicon |
Si |
0.00267221 g |
99.00000 % |
3.67823 % |
| Total: |
0.00269920 g |
|
|
Encapsulation
|
| Substances |
weight |
% of material |
% of package |
| Antimony Trioxide |
Sb2O3 |
0.00088760 g |
2.00000 % |
1.22176 % |
| Carbon black |
C |
0.00013314 g |
0.30000 % |
0.18326 % |
| Epoxy resin |
EP |
0.00443800 g |
10.00000 % |
6.10880 % |
| Formaldehyde, polymer with bromophenol and (chloro |
|
0.00110950 g |
2.50000 % |
1.52720 % |
| Phenol, Polymer with Formaldehyde |
|
0.00221900 g |
5.00000 % |
3.05440 % |
| Silica, vitreous |
Si |
0.03559276 g |
80.20000 % |
48.99259 % |
| Total: |
0.04438000 g |
|
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Lead Finish
|
| Substances |
weight |
% of material |
% of package |
| Misc. |
|
0.00000013 g |
0.01000 % |
0.00018 % |
| Tin |
Sn |
0.00130987 g |
99.99000 % |
1.80300 % |
| Total: |
0.00131000 g |
|
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Lead Frame
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| Substances |
weight |
% of material |
% of package |
| Copper |
Cu |
0.02421390 g |
99.81000 % |
33.32987 % |
| Misc. |
|
0.00000970 g |
0.04000 % |
0.01336 % |
| Zirconium |
Zr |
0.00003639 g |
0.15000 % |
0.05009 % |
| Total: |
0.02426000 g |
|
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Solder Bumps
|
| Substances |
weight |
% of material |
% of package |
| Lead |
Pb |
0.00000007 g |
95.00000 % |
0.00009 % |
| Tin |
Sn |
0.00000000 g |
5.00000 % |
0.00000 % |
| Total: |
0.00000007 g |
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For information on "Green" molding compounds, please contact your local sales representative.
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RoHS and other substances of concern
| Die |
| Substances |
0.00269920 g |
ppm |
w/avg ppm |
| Cadmium |
Cd |
|
< 5 ppm |
< 0.186 ppm |
| Hexavalent Chromium |
Cr+6 |
|
< 2 ppm |
< 0.074 ppm |
| Lead |
Pb |
|
< 5 ppm |
< 0.186 ppm |
| Mercury |
Hg |
|
< 2 ppm |
< 0.074 ppm |
| Polybrominated Biphenyls |
PBB |
|
< 5 ppm |
< 0.186 ppm |
| Polybrominated Diphenyl Ethers |
PBDE |
|
< 5 ppm |
< 0.186 ppm |
| Encapsulation |
| Substances |
0.04438000 g |
ppm |
w/avg ppm |
| Antimony Trioxide |
Sb2O3 |
|
= 20000 ppm |
= 12217.600 ppm |
| Brominated Flame Retardants |
BFR |
|
= 25000 ppm |
= 15272.000 ppm |
| Bromine |
Br |
|
< 5 ppm |
< 3.054 ppm |
| Cadmium |
Cd |
|
< 2 ppm |
< 1.222 ppm |
| Hexavalent Chromium |
Cr+6 |
|
< 2 ppm |
< 1.222 ppm |
| Lead |
Pb |
|
= 8 ppm |
= 4.887 ppm |
| Mercury |
Hg |
|
< 2 ppm |
< 1.222 ppm |
| Polybrominated Biphenyls |
PBB |
|
< 5 ppm |
< 3.054 ppm |
| Polybrominated Diphenyl Ethers |
PBDE |
|
< 5 ppm |
< 3.054 ppm |
| Lead Finish |
| Substances |
0.00131000 g |
ppm |
w/avg ppm |
| Cadmium |
Cd |
|
< 2 ppm |
< 0.036 ppm |
| Hexavalent Chromium |
Cr+6 |
|
< 2 ppm |
< 0.036 ppm |
| Lead |
Pb |
|
= 7 ppm |
= 0.126 ppm |
| Mercury |
Hg |
|
< 2 ppm |
< 0.036 ppm |
| Polybrominated Biphenyls |
PBB |
|
< 5 ppm |
< 0.090 ppm |
| Polybrominated Diphenyl Ethers |
PBDE |
|
< 5 ppm |
< 0.090 ppm |
| Lead Frame |
| Substances |
0.02426000 g |
ppm |
w/avg ppm |
| Cadmium |
Cd |
|
< 2 ppm |
< 0.668 ppm |
| Hexavalent Chromium |
Cr+6 |
|
< 2 ppm |
< 0.668 ppm |
| Lead |
Pb |
|
< 2 ppm |
< 0.668 ppm |
| Mercury |
Hg |
|
< 2 ppm |
< 0.668 ppm |
| Nickel |
Ni |
|
= 0 ppm |
= 0.000 ppm |
| Polybrominated Biphenyls |
PBB |
|
< 5 ppm |
< 1.670 ppm |
| Polybrominated Diphenyl Ethers |
PBDE |
|
< 5 ppm |
< 1.670 ppm |
| Solder Bumps |
| Substances |
0.00000007 g |
ppm |
w/avg ppm |
| Cadmium |
Cd |
|
< 2 ppm |
< 0.000 ppm |
| Hexavalent Chromium |
Cr+6 |
|
< 2 ppm |
< 0.000 ppm |
| Lead |
Pb |
|
= 10600 ppm |
= 0.010 ppm |
| Mercury |
Hg |
|
< 2 ppm |
< 0.000 ppm |
| Polybrominated Biphenyls |
PBB |
|
< 5 ppm |
< 0.000 ppm |
| Polybrominated Diphenyl Ethers |
PBDE |
|
< 5 ppm |
< 0.000 ppm |
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The less than (<) symbol is used to indicate that the test results are below
the amounts indicated, which are the minimum detection limits of the laboratory
performing the testing. The exception to this is for plating containing lead, where
the maximum amount of lead is listed.
RoHS maximum limits (ppm): 1000 for Pb, Hg, Cr6+, PBB, PBDE (exemption: lead if
solderballs are used.) 100 for Cd.
Reportable substances (if present): Antimony Trioxide, Brominated Flame Retardants,
Nickel.
Weighted average = for part as a whole.
The information included herein is believed to be accurate and reliable. However,
Allegro MicroSystems, Inc. assumes no responsibility for its use. The user is cautioned
to verify that the information being relied upon is current.
|
As a supplier of components, we are not required to assess regulatory requirements (such as the
European RoHS Directive (2003/95/EC) - hereinafter referred to as RoHS) that apply to finished
product. Please note further that product may contain small amounts of lead. Therefore, we cannot
make representations, warranties or indemnities regarding the complete absence of lead in the finished product.
You will note that, if there is sufficient volume and the above referenced product is not below RoHS allowable
thresholds, we are prepared to discuss making a product listed by Allegro that is below RoHS allowable thresholds.
Allegro MicroSystems, Inc. is a cooperative environmental supplier who fully supports global environmental initiatives.
We value our customer relationships and are committed to provide the highest levels of quality standards.
Geoffrey H. DesRosiers
Quality Systems Specialist