Precision Angle Sensor IC with On-Chip Linearization and Enhanced Diagnostics

AAS33051

AAS33051 Product Image

The AAS33051 provides precise angle measurements with on-chip linearization, enhanced diagnostics, and multiple output formats (SPI, PWM, UVW/ABI) for demanding automotive applications.

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Top Features

Packaging

  • Contactless 0° to 360° angle sensor IC, for angular position, rotational speed, and direction measurement
    • Capable of sensing magnet rotational speeds targeting 12.5-bit effective resolution with 300 G field; higher effective resolution possible at higher field strengths
    • Circular Vertical Hall (CVH) technology provides a single channel sensor system, with air gap independence
  • On-chip 32 segment linearization to improve angle accuracy
    • Reduces impact of magnet to sensor misalignment
    • Reduces impact of imperfect magnetization of target magnet
  • Developed as a Safety Element out of Context (SEooC) in accordance with ISO 26262:2011 requirements for hardware product development for use in safety-critical applications (pending assessment)
  • High diagnostic coverage
    • On-chip diagnostics include logic built-in self-test (LBIST), signal path diagnostics, and watchdogs to support safety critical applications
    • 4-bit CRC on SPI
  • On-chip EEPROM for storing factory and customer calibration parameters
    • Single-bit error correction; dual-bit error detection, error correction control (ECC)
  • Supports operating in harsh conditions required for automotive and industrial applications, including direct connection to 12 V battery
    • Operating temperature range from –40°C to 150°C
    • Operating supply voltage range from 3.7 to 18 V, absolute maximum of 28 V continuous
      ♦Can support ISO 7637-2 Pulse 5b up to 39 V
  • Low power mode and turns counter feature to keep track of motor position in automotive applications when the vehicle is turned off
    • Loss of power is indicated by reset flag
    • Externally stored positions can be written back to the turns counter
    • Multiple output formats supported for ease of system integration
    • ABI and UVW interfaces provide high resolution and lowest latency angle information
    • PWM interface provides initial position for ABI/UVW interfaces
    • 10 MHz SPI for low latency angle and diagnostic information; enables multiple independent ICs to be connected to same bus
      ♦5 V SPI can be supported
    • Output resolution on ABI and UVW are selectable
  • Multiple programming / configuration formats supported
    • The system can be completely controlled and programmed over SPI, including EEPROM writes
    • For system with limited pins available, writing and reading can be performed over VCC and PWM pins. This allows configuring the EEPROM in production line for a device with only ABI/UVW and PWM pins connected.
  • 1 mm thin surface-mount TSSOP packages for both single and dual die versions to minimize air gap from target magnet to CVH transducer for improved field strength
    • Pin-compatible to single and dual die A1339 devices
    • Stacked dual die construction to improve channel-to-channel matching for systems that require redundant sensors

The AAS33051 is available in a dual-die 24-pin eTSSOP and a single-die 14-pin TSSOP package. The packages are lead (Pb) free with 100% matte-tin leadframe plating. The 1 mm thin package reduces the minimum air gap between the CVH transducer and the target magnet. The AAS33051 device is pin-compatible with the A1339 to enable easy migration.

LE Package Documentation

LP Package Documentation

Part Number Specifications and Availability

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