Packaging
Did you know Allegro was the first to offer the very low 100 micro-ohm CB package with high isolation for sensing up to 200 amps?
We continue to drive innovation in our packaging portfolio to meet your demands for more highly integrated products with smaller footprints, thinner profiles, and more input/output pins per package.
Package Application Notes (PDF)
- Soldering Methods for Allegro's Products — SMD and Through-Hole
- Guidelines for Designing Subassemblies Using Hall-Effect Devices
- Procedure for Measuring Pad-to-Ambient Thermal Resistance (RθPA) for Exposed Pad Packages
- Guidelines for Leadforming Using Back-Biased Hall-Effect Devices
- Chemical Exposure of Devices
- Wettable Flank Plated PQFN