Allegro MicroSystems - 传感器 IC 封装组合

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传感器 IC

Allegro MicroSystems 公司是开发和制造创新、可靠、高性能霍尔效应磁传感器 IC 的领导者。 Allegro 传感器 IC 的发展不仅仅包括在整合电路设计领域引领创新，还包括在定制封装设计领域应用特定的创新。

Allegro 定制封装发展的部分概述包括：

专利整合式磁封装，可简化汽车速度感应应用中的磁系统设计。参见 SE、SG、SH 和 SJ 封装。

创新的带高带宽磁设计功能的整合式电流感应封装。参见整合式低阻抗电流导体 SOIC、QSOP 和 CA/CB 封装和 1 mm 厚的 KT 封装。

小尺寸纤薄 DFN 封装，适用于通信和消费者产品。参见 EW 和 CG 封装。

以下的封装选项是 Allegro 最近高技术封装的概述。