封装
Use the selection guide below to find and download specific package information
Package Application Notes (PDF)
- Soldering Methods for Allegro's Products — SMD and Through-Hole
- Guidelines for Designing Subassemblies Using Hall-Effect Devices
- Procedure for Measuring Pad-to-Ambient Thermal Resistance (RθPA) for Exposed Pad Packages
- Guidelines for Leadforming Using Back-Biased Hall-Effect Devices
- Chemical Exposure of Devices
- Wettable Flank Plated PQFN
