Package Selection Guide

Interaction between a semiconductor circuit and its package can significantly affect product performance. Critical characteristics of the package include the ability to dissipate heat, and to withstand vibration, shock, high temperature, high humidity, and other environmental conditions. Our packaging portfolio continues to evolve to meet the demands for more highly integrated products with smaller footprints, thinner profiles, and more input/output pins per package.

Use the selection guide below to find and download specific package information.

ALLEGRO MICROSYSTEMS, LLC STRIVES TO ENSURE THE ACCURACY AND COMPLETENESS OF THE INFORMATION PROVIDED IN THESE OUTLINE DRAWINGS AND THERMAL CHARACTERISTIC FILES. HOWEVER, INFORMATION CONTAINED IN THESE FILES IS INTENDED ONLY FOR REFERENCE PURPOSES. IT IS THE RESPONSIBILITY OF THE USER TO AUTHENTICATE ANY INFORMATION PROVIDED IN THESE OUTLINE DRAWINGS AND THERMAL CHARACTERISTIC FILES BY COMPARING SUCH INFORMATION WITH THE CORRESPONDING INFORMATION OF THE APPROPRIATE ALLEGRO PRODUCT DATASHEET.

Package Application Notes (PDF)

• Soldering Methods for Allegro's Products — SMD and Through-Hole
• Guidelines for Designing Subassemblies Using Hall-Effect Devices 
• Procedure for Measuring Pad-to-Ambient Thermal Resistance (RθPA) for Exposed Pad Packages
• Leadforming Using Back-Biased Hall-Effect Devices
• Chemical Exposure of Devices 

Reference

• Allegro Part Numbering Guide (296085AN)
• Package Thermal Characteristics (PDF)