Power IC Package Portfolio | Allegro MicroSystems

Contact Sales

Have Questions? Let us help!

We're passionate about innovation. Reach out and you'll hear back from an expert shortly.

Required*

This field is required

First name *

This field is required

Last Name *

Please enter a valid Email Address

Business Email *

Phone number

This field is required

Job Title *

This field is required

Company *

This field is required

Country *

This field is required

State/ Province *

This field is required

Postal / Zip Code *

Comments

Stay informed about Allegro news, events and offers. You can review our opt-in messaging details in our Privacy Notice

This field is required

By selecting “confirm” you grant Allegro permission to process your data and send you information. *

Form Unavailable

In accordance with your Cookie preferences this form is not currently available. Should you wish to make a submission please allow Performance cookies to run in your browser session. You can access and change your preferences via the Cookie Settings button below or through our Footer link ‘Cookie Notice’ > ‘Cookie Settings’. If you still have issues seeing the form after accepting cookies please try and clear your local cookies and reload the page and accept the Performance cookies again.

Integrated Circuits

Allegro MicroSystems is a leader in developing, manufacturing and marketing high-performance semiconductors. Allegro's innovative solutions serve high-growth applications within the automotive market, with additional focus on office automation, industrial, and consumer/communications solutions.

Allegro’s power IC packages offer industry-leading thermal performance with limited board space.

TSSOP – Industry-standard TSSOP with optional exposed pad for enhanced thermal performance

QFP – Universal quad flat pack with exposed pad for enhanced thermal performance

QFN/TDFN – Quad and dual, low-profile, surface-mount packages with exposed pad for enhanced thermal performance (wettable flank options available)

MSOP – Industry-standard miniature small outline package with optional exposed pad for enhanced thermal performance

SOIC – Small outline integrated circuit with optional exposed pad for enhanced thermal performance

CSP – Wafer level chip scale

Additional industry-standard packaging options are available to meet individual design requirements.

To view a sampling of Allegro’s most recent, high technology packages click here.