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Semiconductor Packaging Publications

  • Back-Biased Packaging Advances
  • Chemical Exposure of Devices
  • Guidelines for Designing Subassemblies Using Hall Effect Devices
  • Soldering Methods for Allegro Products (SMD and Through-Hole)
  • Wettable Flank Plated PQFN
  1. Homepage
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  3. Semiconductor Packaging Publications

Semiconductor Packaging Publications

  • Package Designators (PDF)
  • Package Dimensions 
  • Package Thermal Characteristics (PDF)
  • Back-Biased Packaging Advances 
  • Chemical Exposure of Devices
  • Guidelines for Designing Subassemblies Using Hall-Effect Devices (PDF)
  • Improving Batwing Power Dissipation (PDF)
  • Procedure for Measuring Pad-to-Ambient Thermal Resistance (RθPA) for Exposed Pad Packages (PDF)
  • Soldering Methods for Allegro's Products — SMD and Through-Hole 
  • Thermal Design for Plastic Integrated Circuits (PDF)
  • Wettable Flank Plated PQFN
  • Guidelines for Leadforming Using Back-Biased Hall-Effect Devices 
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